Relentlessly shrinking components
ORLANDO, Fla.–As new markets emerge for semiconductors and systems (or older ones evolve), the demands on component design seem to intensify.
Miniaturization is relentless, but then there's temperature, especially when markets like deep-well drilling take off as they have in the past few years. How do you make your products smaller and ensure they don't melt in the field?
Micross, which has an operation here, tries to stay on top of these trends in its position as a manufacturer of high-reliability systems for industrial, medical and military customers.
The company's aptly-named project engineer Chip O'Toole, and General Manager Tony Hamby describe the challenges Micross faces around miniaturization and high-temperature environments:
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Editorial Director for EE Times' EE Life engineering community. Baseball fan and road trip guy for the next several months. View all posts by Brian →This entry was posted in Homepage Carousel, On the Road, Videos and tagged Chip O'Toole, components, electronics, ems, engineering, Micross, systems, Tony Hamby.